Soldering Process
Soldering is the process of joining two metals using a solder alloy, and it is one of the oldest known joining techniques. Faulty solder joints remain one of the major causes of equipment failure; thus, the importance of high standards of workmanship in soldering cannot be overemphasized. The guide covers basic soldering procedures and has been designed to provide the fundamental knowledge needed to complete most high-reliability hand soldering and component removal operations.
Properties of Solder
Solder, used for electronics, is a metal alloy that combines various elements in different proportions. These proportions are usually marked on the various types of solder available. With many solders, melting does not occur simultaneously. For example, 50/50 tin/lead solder begins to melt at 183 C (361 F) but is not fully melted until the temperature reaches 216 C (420 F). Between these two temperatures, the solder exists in a plastic or semi-liquid state. The plastic range of a solder varies depending upon the ratio of elements. With 60/40 tin/lead solder, the range is much smaller than 50/50 solder. The 63/37 ratio, known as eutectic solder, has practically no plastic range and melts almost instantly at 183 C (361 F). Movement during the solidification may cause what is known as a disturbed joint. A disturbed joint has a rough, irregular appearance and looks dull instead of bright and shiny. A disturbed solder joint may be unreliable and may require rework.
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